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 Environmental & Mechanical Specifications for Oscillators

Gross Leak Test Hermetically Sealed Package Seal Strength Bend Test Pin Material Solvent Resistance
Marking Ink Solderability Maximum Soldering Temperature Shock Test Vibration Test Temperature Cycle

 Gross Leak Test
 All units 100% leak tested in Fluorinert FC-43.



 Hermetically Sealed Package
 Mass spectrometer leak rate less than 2 x 10 -8 Atm. CC/sec. of helium.



 Seal Strength
 20 lbs. max. force perpendicular to top and bottom. Subsequently gross leak tested.



 Bend Test
 Will withstand maximum bend of 90°, referenced to base, for 2 bends. Subsequently gross leak tested.



 Pin Material
 Iron and Nickel - Nickel coated, solder dipped.



 Solvent Resistance
 Isopropyl Alcohol, TrichloroethaneNote 1 - Ultrasonic cleaning not to be used. Note 2 - Unit can be cleaned in only one  solvent listed.



 Marking Ink
 (Epoxy, heat cured)



 Solderability
 The terminals are considered solderable and acceptable for electrical connection if 95% of the cooled solder surface is    uniform and free from breaks and pinholes. The other 5% of the cooled solder surface may show only pinholes, voids, or  rough spots that are not concentrated in one area.



 Maximum Soldering Temperature
 260°C for 10 seconds on leads.



Shock Test
1000 G's, 0.35 ms, 1/2 sine wave, 3 shocks each plane.



 Vibration Test
 10-55 Hz, 0.060" D. A., 55-2000 Hz, 20 G's, duration time 12 hours.



 Temperature Cycle
 5°Cycles from -55°C to +125°C, 1 hour per cycle, 25°C ref.

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